Embedded and hardware engineering project, Turin, Italy. 2025.
Key contributions
- Defined hardware specifications to meet measurement-accuracy and reliability requirements under harsh operating conditions
- Drew the mixed-signal schematic in Cadence OrCAD following TI’s official reference design, including an electrical isolation circuit protecting the MCU from motor high-frequency noise and ground-loop interference
- Completed PCB layout to RF design guidelines, achieving precise 50 Ω impedance matching and antenna performance optimization for signal integrity
- Performed component selection and BOM validation against application-note parameters, balancing industrial reliability (RoHS) against cost
- Developed embedded firmware in TI Code Composer Studio using TI’s packaged IP cores and protocol stack libraries